Shinsung Electronic Precision

Chill & WCP Plate Assy

Chill Plate

• Taking out Wafer in bake unit heater, and then cooling
  at the optimal temperature by 20%

WCP Plate

• Wafter is cooled evenly to 23°C
• The most critical quality control point is the management of adhesiveness of the coolant (constant temperature water) line (leaking points not acceptable)

Spin Chuck & Nozzle Assy

Spin Chuck

• Wafer clamp (Max. RPM 2,000) when etching, cleaning, rinsing, and drying

Nozzle driving part

• Used to cleanse particles produced when etching wafer
• A cleansing liquid (DI, IPA, HF, DHF, sulfuric acid, etc.) is used, so metal equipment is treated with a special coat to improve the abrasion rate.
• Precision assembly quality control to improve the quality of semiconductors

Guide Bracket & Block

Manufactures various parts such as base plates, and ships after surface treatment